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Paper
Reliability analysis of Cu contacts with various diffusion barriers, Wang, K.; Wilson, C.J.; Cuthbertson, A.; Herberholz, R.; Coulson, H.P.; O'Neill, A.G.; Horsfall, A.B.; Atmel North Tyneside Ltd., Newcastle upon Tyne
Current Technical Trends: Dual Damascene & Low-k Dielectrics, Healey on behalf of Threshold Systems
Economic Analysis of NIST's Low-k Materials Characterization Research, Brent R. Rowe, Michael P. Gallaher; Dorota S. Temple; Alex V. Rogozhin; RTI International