Advanced search
Home
Lexicon
Search
Statistics
Technology
Acronyms
Downloads
Images
References
Sitemap
Fundamentals
Wafer Fabrication
Oxidation
Deposition
Metallization
Photolithography
Wet Chemistry
Dry Etching
Lexicon
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Z
Acronyms
Sitemap
Fundamentals
The atomic structure
The atomic model
Properties of atoms
The elements, the periodic table
The elements
The periodic table of the chemical elements
Chemical bonds
Chemical bonds
The atomic bond
The ionic bond
The metallic bonding
Noble gases
Conductors - Insulators - Semiconductors
Conductors
Insulators
Semiconductors
The band model
Doping
Doping
n-doping
p-doping
Electronic band structure in doped semiconductors
The p-n junction
p-n junction at equilibrium
p-n junction with external applied voltage
Field-effect transistors
General layout
Construction of a n-channel FET
Mode of operation
Bipolar transistors
General layout
Construction of an NPN bipolar transistor
Mode of operation
Wafer Fabrication
Silicon
Production of raw silicon
Production of raw silicon
Purification of the raw silicon
Zone cleaning
Fabrication of the single crystal
The single crystal
Czochralski process
Float-zone silicon
Wafer fabrication
Wafer separation and surface refinement
Origination of the wafer size
Doping techniques
Definition
Diffusion
Diffusion methods
Ion implantation
Oxidation
Overview
Application
Properties of oxide layers
Fabrication of oxide layers
Thermal oxidation
Oxidation by vapor deposition
LOCOS technology
Very large-scale integration
Bird's beak
Alternative
Film thickness measurement
Metrology
Interferometry
Ellipsometry
Evaluation of the measurement
Deposition
Plasma, 4th state of matter
Plasma state
Plasma generation
Chemical vapor deposition
Silicon vapor phase epitaxy
CVD process: Chemical Vapor Deposition
APCVD: Atmospheric Pressure CVD
LPCVD: Low Pressure CVD
PECVD: Plasma Enhanced CVD
ALD: Atomic Layer deposition
Physical deposition methods
Molecular beam epitaxy
Evaporating
Sputtering
Metallization
Requirements on metallization
Aluminum technology
Aluminum and aluminum alloy
Diffusion in silicon
Electromigration
Hillocks
Copper technology
Copper technology
Damascene process
Low-k technology
Metal semiconductor junction
Metal semiconductor junction
Band model of p-n junctions
Wiring
Wiring
BPSG reflow
Reflow back etching
Chemical mechanical polishing
Contacting
Photolithography
Exposure and resist coating
Overview
Adhesives
Coating
Exposure
Exposure methods
Exposition methods
Overview
Contact exposure
Proximity exposure
Projection
Electron beam lithography
X-ray lithography
Additional methods
Photoresist
Photoresist
Chemical composition
Development and inspection
Development
Inspection
Resist removal
Photomasks
Introduction
Photomask manufacture
Photomasks
Next generation lithography
Wet Chemistry
Etch processes
Wet etching
Principle
Requirements
Batch etching
Spray etching
Anisotropic etching of silicon
Etching solutions for isotropic etching
Wafer cleaning
Cleanroom
Types of contamination
Microscopic contamination
Molecular contamination
Alkaline and metallic contamination
Cleaning techniques
Dry Etching
Overview
Abstract
Major values in dry etching
Dry etch processes
Dry etch processes
Ion Beam Etching
Plasma Etching
Reactive Ion Etching
References
Home
Top
2002–2010 Philipp Laube · 307497 visitors · Updated 07/21/2010
Contact
Imprint
