Semiconductor Technology from A to Z
ca. 1.7 MB, 143 pages
Fundamentals
- ca. 470 KB
- Full
- ca. 119 KB
- The atomic structure
- ca. 106 KB
- The periodic table
- ca. 98 KB
- Chemical bonds
- ca. 58 KB
- Noble gases
- ca. 140 KB
- Conductors - Insulators - Semiconductors
- ca. 94 KB
- Doping
- ca. 72 KB
- The p-n junction
- ca. 149 KB
- Field-effect transistors
- ca. 128 KB
- Bipolar transistors
- ca. 108 KB
- Construction of a FinFET
Wafer fabrication
- ca. 232 KB
- Full
- ca. 58 KB
- Properties of silicon
- ca. 93 KB
- Raw silicon
- ca. 82 KB
- Fabrication of the single crystal
- ca. 111 KB
- Wafer fabrication
- ca. 152 KB
- Doping techniques
Oxidation
- ca. 504 KB
- Full
- ca. 83 KB
- Overview
- ca. 132 KB
- Fabrication of oxide layers
- ca. 126 KB
- LOCOS process
- ca. 294 KB
- Film thickness measurement
Deposition
- ca. 256 KB
- Full
- ca. 107 KB
- Plasma
- ca. 196 KB
- Chemical vapor deposition
- ca. 111 KB
- Physical deposition methods
Metallization
- ca. 271 KB
- Full
- ca. 62 KB
- Requirements on metallization
- ca. 119 KB
- Aluminum technology
- ca. 156 KB
- Copper technology
- ca. 112 KB
- Metal semiconductor junction
- ca. 93 KB
- Wiring
Photolithography
- ca. 521 KB
- Full
- ca. 238 KB
- Exposure and resist coating
- ca. 167 KB
- Exposition methods
- ca. 78 KB
- Photoresist
- ca. 104 KB
- Development and inspection
- ca. 138 KB
- Photomasks
Wet chemistry
- ca. 181 KB
- Full
- ca. 90 KB
- Etch processes
- ca. 111 KB
- Wet etching
- ca. 132 KB
- Wafer cleaning
Dry etching
- ca. 209 KB
- Full
- ca. 106 KB
- Overview
- ca. 166 KB
- Dry etch processes