Metallization

01

Requirements on metallization

• Requirements on metallization

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02

Aluminum technology

• Aluminum and aluminum alloys
• Diffusion in silicon
• Electromigration
• Hillocks

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03

Copper technology

• Copper technology
• Damascene process
• Low-k technology
• Limits of copper wiring

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04

Metal semiconductor junction

• Contacting doped semiconductors
• n-type semiconductor contact
• p-type semiconductor contact
• Band model of a p-n junction

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05

Chemical Mechanical Polishing (CMP)

• Why planarization is necessary
• Principle of the CMP process
• STI-CMP
• ILD-CMP
• Tungsten CMP
• Copper Damascene CMP
• Dishing, Erosion & Dummy Fill
• Endpoint Detection & Process Control

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06

Wiring

• Multilayer wiring
• BPSG reflow
• Reflow back etching
• Chemical mechanical polishing
• Contacting the metallization layers

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