Semiconductor Technology
from A to Z
Everything about semiconductors and wafer fabrication
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Chapter
Fundamentals
The atomic structure
The elements, the periodic table
Chemical bonds
Noble gases
Conductors – Insulators – Semiconductors
Doping: n- and p-semiconductors
The p-n junction
Transistors and Memory
CMOS vs. Bipolar
Bulk vs. SOI
Wafer Fabrication
Silicon
Production of raw silicon
Fabrication of the single crystal
The wafer
Doping techniques
Oxidation
Overview
Fabrication of oxide layers
LOCOS technology
Deposition
Plasma, the fourth aggregation state of a material
Chemical vapor deposition
Physical deposition methods
Metallization
Requirements on metallization
Aluminum technology
Copper technology
Metal semiconductor junction
Wiring
Photolithography
Exposure and resist coating
Exposition methods
Photoresist
Development and inspection
Photomasks
Optical Proximity Correction (OPC)
DUV vs. EUV
Wet Chemistry
Etch processes
Wet etching
Wafer cleaning
Dry Etching
Overview
Dry etch processes
Reactor Types
Compound Semiconductors and High-k Materials
Compound Semiconductors
Fundamentals & Material System
Crystal Growth & Substrates
SiC Power Devices
GaN Power Devices
Applications & System Comparison
Metrology
Film thickness measurement
Particle inspection
Overlay Measurement
Wafer Test
Wafer Test
Final Test and Binning
Assembly
Dicing
Die Attach
Bonding
Encapsulation
Advanced Packaging / 3D Integration
Limits of Classical Integration
Through-Silicon Via (TSV)
2.5D Integration: The Interposer
3D Stacking
Chiplets & Heterogeneous Integration
Applications & Outlook
Devices
Field-effect transistors
Bipolar transistors
Construction of a FinFET
DRAM Fabrication: The Trench Capacitor Process
Digital technology
From transistor to logic gate
The CMOS Fabrication Flow
The SRAM Cell
The DRAM Cell
The Flash Memory Cell
Design Rules
Layout versus Schematic (LVS)
Circuit Layouts
Processor Architecture
CPU vs. GPU
Why New Memory Technologies?
MRAM – Magnetoresistive RAM
ReRAM – Resistive RAM
PCM – Phase-Change Memory
Comparison & Context
Micromechanics
Introduction to MEMS
Anisotropic Etching of Silicon
Sacrificial Layer Technique
Bulk vs. Surface Micromachining
The MEMS Accelerometer
The Microphone and Pressure Sensor
DRIE: Deep Reactive Ion Etching
Optoelectronics & Photonics
Fundamentals of Optoelectronics
Light-Emitting Diodes (LED)
Laser Diodes
Photodiodes & Photodetectors
Integration & Applications
Process Flow
Supply Chain
PDF
Chipfertigung
Lexicon
Technology
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1000 nm
800 nm
600 nm
350 nm
250 nm
180 nm
130 nm
90 nm
65 nm
45 nm
32 nm
22 nm
16 nm
11 nm
7 nm
5 nm
3 nm
2 nm
Akronyms
Statistics
Bit per euro (DRAM)
Evolution of the gate length of MOSFETs
Exposure wavelength vs. critical dimensions
FLOPS: floating point operations
Intel:AMD - CPU clock
Intel:AMD - Number of transistors
Intel:AMD - Process development
Manufacturing costs for different technology nodes
Manufacturing costs per transistor
Millions of instructions per second
Number of calculations per second per 1000 euro
Number of manufactured bits
Optoelectronics & Photonics
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Fundamentals of Optoelectronics
Why Optoelectronics?
Direct vs. Indirect Bandgap
Photon Energy and Bandgap
Material System Overview
Quantum Efficiency as a Metric
Light-Emitting Diodes (LED)
Structure and Operating Principle
Material Systems by Color
Quantum Wells for Improved Efficiency
Droop and Extraction Efficiency
From Emission to Usable Light Output
Laser Diodes
From LED to Laser: Population Inversion and Stimulated Emission
The Optical Resonator and Mode Formation
Edge Emitters: Fabry-Pérot and DFB Lasers
VCSEL: Structure and Advantages
Material Systems and Applications
Photodiodes & Photodetectors
Operating Principle: pn and pin Photodiodes
Key Parameters: Quantum Efficiency and Responsivity
Avalanche Photodiode (APD)
Material Choice by Wavelength Range
Applications: Fiber-Optic Communication and Image Sensing
Integration & Applications
The Optical Transmission Chain
Display Technology: LED Backlighting, µLED, and OLED Compared
Sensing: LiDAR and Time-of-Flight
Sensing: Pulse Oximetry and Proximity Sensors
Photonic Integrated Circuits (PICs) – Outlook
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Fundamentals of Optoelectronics
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Content
Fundamentals
Wafer Fabrication
Oxidation
Deposition
Metallization
Photolithography
Wet Chemistry
Dry Etching
Compound Semiconductors
Metrology
Wafer Test
Assembly
Advanced Packaging / 3D Integration
Devices
Digital technology
Micromechanics
Optoelectronics & Photonics
Fundamentals of Optoelectronics
Light-Emitting Diodes (LED)
Laser Diodes
Photodiodes & Photodetectors
Integration & Applications