Whether and in which direction electrons flow at the contact is determined by the work function of the two materials – the energy required to release an electron from the Fermi level out of the material. If the work function of the metal is greater than that of the n-type semiconductor (as is the case, for example, with aluminum on silicon), the Fermi level of the metal lies energetically lower: upon contact, electrons flow from the silicon into the metal, since they can occupy energetically more favorable states there. In the opposite case – work function of the metal smaller than that of the n-type semiconductor – no barrier forms; instead, an ohmic contact is established right from the start.
Thus, the probability of electrons being present in the conduction band of the semiconductor decreases: the distance between the conduction band edge and the Fermi level – which describes the highest energy state still occupied by electrons – increases at the interface.
Due to the departed negative charge carriers, positive donors (e.g. phosphorus ions) remain behind, and a space charge region is formed. The bending of the conduction band illustrates the voltage barrier (Schottky barrier) that the remaining electrons in the n-type conductor must overcome in order to flow into the metal.
When metal and semiconductor come into contact, the Fermi levels align through diffusion processes; in the region of the interface, the Fermi level is constant.
The width w of the depletion zone depends on the strength of the doping. The electrons that have migrated out of the semiconductor generate a negative space charge in the metal, which is confined to the surface region.
This metal-semiconductor contact exhibits a nonlinear current-voltage characteristic, known as a Schottky diode. Electrons can overcome this barrier either through thermal energy from outside or by "tunneling" through it under an applied electric field (according to quantum theory, a particle can cross a region in which it cannot exist for energetic reasons by, to put it in simplified terms, briefly borrowing energy to overcome the barrier and then returning that energy: the tunneling effect). This effect can also be observed with aluminum. Since aluminum always oxidizes at the surface, two aluminum surfaces placed against each other would have an insulating effect. However, a current flow can be observed, which is based on the tunneling effect.
Depending on the application, one may want to produce this diode effect or prevent it. To create an ohmic contact, i.e. a contact without this potential barrier, the contact area can be heavily doped (n+ doping) so that the depletion zone becomes very thin and the metal-semiconductor contact exhibits a linear current-voltage relationship as a result of the tunneling effect.
Since aluminum is incorporated into silicon as an electron acceptor (it accepts electrons), forming a p-doping at the interface, an ohmic contact results with p-doped silicon. In an n-doped region, however, the aluminum causes a doping reversal, so that a p-n junction is formed here: a diode. There are two ways to avoid this:
- the n-doped region is doped so heavily that the aluminum only weakens it but does not reverse it
- an intermediate layer of titanium, chromium, or palladium prevents the re-doping of the n-doped regions
To improve the contacts, metal silicides (metals combined with silicon) can also be applied to the contact surface.
In contrast to the diode at the p-n junction, where the switching speed relies on the diffusion of electrons, Schottky diodes have very short switching times. They are therefore suitable as protection diodes to absorb voltage spikes.