Semiconductor Technology
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Everything about semiconductors and wafer fabrication
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Bit per euro (DRAM)
Evolution of the gate length of MOSFETs
Exposure wavelength vs. critical dimensions
FLOPS: floating point operations
Intel:AMD - CPU clock
Intel:AMD - Number of transistors
Intel:AMD - Process development
Manufacturing costs for different technology nodes
Manufacturing costs per transistor
Millions of instructions per second
Number of calculations per second per 1000 euro
Number of manufactured bits
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Fundamentals
The atomic structure
The atomic model
Properties of atoms
The elements, the periodic table
The elements
The periodic table of the chemical elements
Chemical bonds
Chemical bonds
The atomic bond
The ionic bond
The metallic bonding
Intermolecular bondings
Noble gases
Conductors – Insulators – Semiconductors
Conductors
Insulators
Semiconductors
The band model
Doping: n- and p-semiconductors
Doping
n-doping
p-doping
Electronic band structure in doped semiconductors
The p-n junction
p-n junction at thermal equilibrium
p-n junction with external applied voltage
Field-effect transistors
General layout
Construction of a n-channel FET
Mode of operation
Bipolar transistors
General layout
Construction of an NPN bipolar transistor
Mode of operation
Construction of a FinFET
General layout and mode of operation
Construction of a bulk silicon-based FinFET
Wafer Fabrication
Silicon
Production of raw silicon
Production of raw silicon
Purification of the raw silicon
Zone cleaning
Fabrication of the single crystal
The single crystal
Czochralski process
Float-zone silicon
The wafer
Wafer separation and surface refinement
Historical development of the wafer size
Why are silicon wafers round?
Doping techniques
Definition
Diffusion
Diffusion methods
Ion implantation
Oxidation
Overview
Application
Properties of oxide layers
Fabrication of oxide layers
Thermal oxidation
Oxidation by vapor deposition
LOCOS technology
Very large-scale integration
Bird's beak
Alternative
Film thickness measurement
Metrology
Interferometry
Ellipsometry
Appraisal of the measurement
Deposition
Plasma, the fourth aggregation state of a material
Plasma state
Plasma generation
Chemical vapor deposition
Silicon vapor phase epitaxy
CVD process: Chemical Vapor Deposition
APCVD: Atmospheric Pressure CVD
LPCVD: Low Pressure CVD
PECVD: Plasma Enhanced CVD
ALD: Atomic Layer deposition
Physical deposition methods
Molecular beam epitaxy
Evaporating
Sputtering
Metallization
Requirements on metallization
Aluminum technology
Aluminum and aluminum alloy
Diffusion in silicon
Electromigration
Hillocks
Copper technology
Copper technology
Damascene process
Low-k technology
Metal semiconductor junction
Metal semiconductor junction
Band model of p-n junctions
Wiring
Wiring
BPSG reflow
Reflow back etching
Chemical mechanical polishing
Contacting
Photolithography
Exposure and resist coating
Overview
Adhesives
Coating
Exposure
Exposure methods
Exposition methods
Overview
Contact exposure
Proximity exposure
Projection
Electron beam lithography
X-ray lithography
Additional methods
Photoresist
Photoresist
Chemical composition
Development and inspection
Development
Inspection
Resist removal
Photomasks
Introduction
Photomask manufacture
Photomasks
Next generation lithography
Wet Chemistry
Etch processes
Wet etching
Principle
Requirements
Batch etching
Spray etching
Anisotropic etching of silicon
Etching solutions for isotropic etching
Wafer cleaning
Cleanroom
Types of contamination
Microscopic contamination
Molecular contamination
Alkaline and metallic contamination
Cleaning techniques
Dry Etching
Overview
Abstract
Main values in dry etching
Dry etch processes
Dry etch processes
Ion Beam Etching
Plasma Etching
Reactive Ion Etching
Overview of gases used in dry etching
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Content
Fundamentals
Wafer Fabrication
Oxidation
Deposition
Metallization
Photolithography
Wet Chemistry
Dry Etching