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Oxidation
Overview
Fabrication of oxide layers
Device isolation
Deposition
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Photoresist
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Overview
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Through-Silicon Via (TSV)
2.5D Integration: The Interposer
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Electromigration, TDDB and NBTI/PBTI
Burn-in and HTOL Testing
Automotive, Military, and Space Qualification
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Devices
Diodes
Zener and Avalanche Diodes
The Schottky Diode
The Tunnel Diode
Thyristors and Triacs
Field-Effect Transistors
Field-Effect Transistor Families: An Overview
Field-effect transistors
Construction of a FinFET
The Junction FET (JFET)
The Metal-Semiconductor FET (MESFET)
Bipolar Transistors
Bipolar transistors
Characteristic Curves and Transistor Equations
Power Devices
Si Power Devices (Power MOSFET, IGBT)
Technology Comparison
CMOS vs. Bipolar
Bulk vs. SOI
Digital technology
Digital Logic Fundamentals
From transistor to logic gate
The CMOS Fabrication Flow
Arithmetic Circuits: Adders and Multipliers
Sequential Logic: Flip-Flops, Latches, and Clock Trees
Static Timing Analysis: Setup and Hold Time
Static and Dynamic Power Dissipation, Leakage Currents
Classic Memory Cells
The SRAM Cell
The DRAM Cell
DRAM Fabrication: The Trench Capacitor Process
The Flash Memory Cell
Next-Gen Memory Technologies
Why New Memory Technologies?
MRAM – Magnetoresistive RAM
ReRAM – Resistive RAM
PCM – Phase-Change Memory
Comparison & Context
EDA & Layout
Circuit Layouts
Design Rules
Layout versus Schematic (LVS)
Processor Architecture
Processor Architecture
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CPU vs. GPU
FPGA vs. ASIC: Synthesis Flow and HDL
Analog & Mixed-Signal Design
Operational Amplifiers
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DAC Architectures
Bandgap References
Comparators
PLL – Phase-Locked Loop
Voltage Regulators: LDOs and Switching Regulators
Noise in Semiconductor Devices
Optoelectronics & Photonics
Fundamentals of Optoelectronics
Light-Emitting Diodes (LED)
Laser Diodes
Photodiodes & Photodetectors
Integration & Applications
Fabrication of Optoelectronic Devices
Solar Cells
Micromechanics
Introduction to MEMS
Anisotropic Etching of Silicon
Sacrificial Layer Technique
Bulk vs. Surface Micromachining
The MEMS Accelerometer
The Microphone and Pressure Sensor
DRIE: Deep Reactive Ion Etching
Compound Semiconductors
Fundamentals & Material System
Crystal Growth & Substrates
SiC Power Devices
GaN Power Devices
Applications & System Comparison
HEMT and HBT for RF Applications
InP-Based Photonic Devices
How does it work? What is..?
Fundamentals & Materials
Fabrication Processes
Devices & Digital Technology
Optoelectronics
Packaging & Other Topics
Semiconductor industry & eco system
History
From PNP to CMOS: Why Semiconductor Logic Took Its Own Path
Pioneers of Semiconductor Technology
The History of the LED
Why the Blue LED Was So Difficult
EUV Lithography – The Most Complex Machine in the World?
Moore’s Law – and Why It Is Getting Harder
The Most Important Semiconductor Materials
The Race for the Smallest Transistor
The Development of the Microprocessor
The History of Chip Manufacturing
The History of Semiconductor Memory
From Germanium to Silicon
The History of the FET
Why Do n-Channel and p-Channel Transistors Exist?
How Taiwan Became a Global Chip Powerhouse
Microchips Behind the Iron Curtain: The History of East Germany’s Semiconductor Industry
From Wire Bond to Chiplet: The History of Semiconductor Packaging
How Eight Engineers Helped Create Silicon Valley
Two Inventors, One Idea: The Birth of the Integrated Circuit
From 3D Accelerator to AI Processor: The History of the GPU
From Bell Labs to the Solar Industry: The History of the Silicon Solar Cell
The History of the Semiconductor Laser: From the Laboratory to the Internet
From CCD to CMOS Sensor: How Silicon Changed Photography
Ever Larger Wafers: Why 300 Millimeters Prevailed
The Battle for the Memory Chip: Japan, Korea, and the United States
From Rectifiers to SiC and GaN: The History of Power Semiconductors
Europe’s Forgotten Transistor: the Transistron
The History of the Bipolar Transistor
Chip Design and EDA: How Hand-Drawn Layouts Became Billions of Transistors
Beyond Silicon: The History of Compound Semiconductors
From Fairchild to TSMC: The History of Semiconductor Companies
The Machines Behind the Chip: The History of Semiconductor Equipment Makers
Mishaps in Semiconductor History: When Tiny Errors Have Major Consequences
Transistor Evolution
Field-Effect Transistors
Bipolar Transistors
From Sand to Chip
Process Flow
Supply Chain
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350 nm
250 nm
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65 nm
45 nm
32 nm
22 nm
16 nm
11 nm
7 nm
5 nm
3 nm
2 nm
Reference
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Bit per euro (DRAM)
Evolution of the gate length of MOSFETs
Exposure wavelength vs. critical dimensions
FLOPS: floating point operations
Intel:AMD - CPU clock
Intel:AMD - Number of transistors
Intel:AMD - Process development
Manufacturing costs for different technology nodes
Manufacturing costs per transistor
Millions of instructions per second
Number of calculations per second per 1000 euro
Number of manufactured bits
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Oxidation
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Oxidation
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Chapters
Overview
Fabrication of oxide layers
Device isolation
01
Overview
Application of Oxide Layers
Properties of oxide layers
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02
Fabrication of oxide layers
Thermal oxidation
Oxidation by vapor deposition
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03
Device isolation
Very large-scale integration
Bird's beak
Shallow Trench Isolation
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