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        • Doping: n- and p-semiconductors
        • The p-n junction
        • Transistors and Memory
      • Wafer Fabrication
        • Silicon
        • Production of raw silicon
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        • The wafer
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        • Personnel in the Cleanroom
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        • Production Area and Wafer Logistics
    • Front-End Processes
      • Oxidation
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        • Device isolation
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        • Plasma, the fourth aggregation state of a material
        • Chemical vapor deposition
        • Physical deposition methods
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        • Exposure and resist coating
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        • DUV vs. EUV
        • EUV Tool Technology
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        • Wafer cleaning
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          • Field-Effect Transistor Families: An Overview
          • Field-effect transistors
          • Construction of a FinFET
          • The Junction FET (JFET)
          • The Metal-Semiconductor FET (MESFET)
        • Bipolar Transistors
          • Bipolar transistors
          • Characteristic Curves and Transistor Equations
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          • Si Power Devices (Power MOSFET, IGBT)
        • Technology Comparison
          • CMOS vs. Bipolar
          • Bulk vs. SOI
      • Digital technology
        • Digital Logic Fundamentals
          • From transistor to logic gate
          • The CMOS Fabrication Flow
          • Arithmetic Circuits: Adders and Multipliers
          • Sequential Logic: Flip-Flops, Latches, and Clock Trees
          • Static Timing Analysis: Setup and Hold Time
          • Static and Dynamic Power Dissipation, Leakage Currents
        • Classic Memory Cells
          • The SRAM Cell
          • The DRAM Cell
          • DRAM Fabrication: The Trench Capacitor Process
          • The Flash Memory Cell
        • Next-Gen Memory Technologies
          • Why New Memory Technologies?
          • MRAM – Magnetoresistive RAM
          • ReRAM – Resistive RAM
          • PCM – Phase-Change Memory
          • Comparison & Context
        • EDA & Layout
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          • Design Rules
          • Layout versus Schematic (LVS)
        • Processor Architecture
          • Processor Architecture
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          • CPU vs. GPU
          • FPGA vs. ASIC: Synthesis Flow and HDL
      • Analog & Mixed-Signal Design
        • Operational Amplifiers
        • ADC Architectures
        • DAC Architectures
        • Bandgap References
        • Comparators
        • PLL – Phase-Locked Loop
        • Voltage Regulators: LDOs and Switching Regulators
        • Noise in Semiconductor Devices
      • Optoelectronics & Photonics
        • Fundamentals of Optoelectronics
        • Light-Emitting Diodes (LED)
        • Laser Diodes
        • Photodiodes & Photodetectors
        • Integration & Applications
        • Fabrication of Optoelectronic Devices
        • Solar Cells
      • Micromechanics
        • Introduction to MEMS
        • Anisotropic Etching of Silicon
        • Sacrificial Layer Technique
        • Bulk vs. Surface Micromachining
        • The MEMS Accelerometer
        • The Microphone and Pressure Sensor
        • DRIE: Deep Reactive Ion Etching
      • Compound Semiconductors
        • Fundamentals & Material System
        • Crystal Growth & Substrates
        • SiC Power Devices
        • GaN Power Devices
        • Applications & System Comparison
        • HEMT and HBT for RF Applications
        • InP-Based Photonic Devices
    • How does it work? What is..?
      • Fundamentals & Materials
      • Fabrication Processes
      • Devices & Digital Technology
      • Optoelectronics
      • Packaging & Other Topics
      • Semiconductor industry & eco system
  • History
    • From PNP to CMOS: Why Semiconductor Logic Took Its Own Path
    • Pioneers of Semiconductor Technology
    • The History of the LED
    • Why the Blue LED Was So Difficult
    • EUV Lithography – The Most Complex Machine in the World?
    • Moore’s Law – and Why It Is Getting Harder
    • The Most Important Semiconductor Materials
    • The Race for the Smallest Transistor
    • The Development of the Microprocessor
    • The History of Chip Manufacturing
    • The History of Semiconductor Memory
    • From Germanium to Silicon
    • The History of the FET
    • Why Do n-Channel and p-Channel Transistors Exist?
    • How Taiwan Became a Global Chip Powerhouse
    • Microchips Behind the Iron Curtain: The History of East Germany’s Semiconductor Industry
    • From Wire Bond to Chiplet: The History of Semiconductor Packaging
    • How Eight Engineers Helped Create Silicon Valley
    • Two Inventors, One Idea: The Birth of the Integrated Circuit
    • From 3D Accelerator to AI Processor: The History of the GPU
    • From Bell Labs to the Solar Industry: The History of the Silicon Solar Cell
    • The History of the Semiconductor Laser: From the Laboratory to the Internet
    • From CCD to CMOS Sensor: How Silicon Changed Photography
    • Ever Larger Wafers: Why 300 Millimeters Prevailed
    • The Battle for the Memory Chip: Japan, Korea, and the United States
    • From Rectifiers to SiC and GaN: The History of Power Semiconductors
    • Europe’s Forgotten Transistor: the Transistron
    • The History of the Bipolar Transistor
    • Chip Design and EDA: How Hand-Drawn Layouts Became Billions of Transistors
    • Beyond Silicon: The History of Compound Semiconductors
    • From Fairchild to TSMC: The History of Semiconductor Companies
    • The Machines Behind the Chip: The History of Semiconductor Equipment Makers
    • Mishaps in Semiconductor History: When Tiny Errors Have Major Consequences
  • Transistor Evolution
    • Field-Effect Transistors
    • Bipolar Transistors
  • From Sand to Chip
    • Process Flow
    • Supply Chain
  • PDF
  • Technology
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    • 32 nm
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    • 11 nm
    • 7 nm
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    • 3 nm
    • 2 nm
  • Reference
    • Lexicon
    • Acronyms
    • Statistics
      • Bit per euro (DRAM)
      • Evolution of the gate length of MOSFETs
      • Exposure wavelength vs. critical dimensions
      • FLOPS: floating point operations
      • Intel:AMD - CPU clock
      • Intel:AMD - Number of transistors
      • Intel:AMD - Process development
      • Manufacturing costs for different technology nodes
      • Manufacturing costs per transistor
      • Millions of instructions per second
      • Number of calculations per second per 1000 euro
      • Number of manufactured bits
DE
› Cleanroom
Knowledge area

Cleanroom

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Chapters Personnel in the Cleanroom Cleanroom Design and Utilities Production Area and Wafer Logistics
01

Personnel in the Cleanroom

  • Humans as a Source of Contamination
  • Personnel Airlock and Gowning
  • Cleanroom Clothing
  • Conduct in the Cleanroom
  • Leaving the Cleanroom
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02

Cleanroom Design and Utilities

  • The Cleanroom as Part of the Fab
  • Air Handling Above the Cleanroom
  • Filter Ceiling and Airflow
  • Pressure, Temperature and Humidity
  • Subfab and Basement
  • Gases, Chemicals and Process Exhaust
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03

Production Area and Wafer Logistics

  • Cleanroom Classes
  • Not Every Part of the Fab Requires the Same Cleanliness
  • Process Tools in the Cleanroom
  • FOUP and Load Port
  • Automated Wafer Transport
  • Process Flow and Production Control
  • Cleanroom Monitoring
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Start with Personnel in the Cleanroom →
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