CMP simultaneously attacks the wafer surface chemically with a reactive slurry and smooths it mechanically with a polishing pad. Raised features are removed faster than recessed areas, producing a globally planar surface. This is essential for multilevel interconnects, since each additional metal layer needs a flat base.
Fabrication Processes
How does lithography work in chip manufacturing?
A light-sensitive photoresist is applied to the wafer and exposed to UV light through a mask. Depending on the resist type, either the exposed or unexposed areas dissolve away during development, transferring the mask pattern into the resist. This pattern then serves as a template for subsequent etch or doping steps.
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