| W | Tungsten |
| W-bit | Wait-bit |
| W/B | Wire Bonding |
| WAN | Wide Area Network |
| WB | Weak Base |
| WBS | Work Breakdown Structure |
| WBSEM | Wire Bonder Specific Equipment Model |
| WC | Wedding Cake |
| WCN | Tungsten-carbon-nitride |
| WD | Working Distance |
| WDM | Wavelength Division Multiplex |
| WDS | Wavelength-dispersive Spectrometry |
| WDX | Wavelength Dispersive X-ray |
| WDXA | Wavelength-dispersive X-ray Analysis |
| WEC | Wafer Environment Control |
| WFT | Wafer Fabrication Template |
| WIB | Within-batch |
| WIP | Work In Process |
| WIP | Work In Progress |
| WIS | Wafer-induced Shift |
| WIW | Within-wafer |
| WIWNU | Within-wafer Nonuniformity |
| WLBI | Wafer-level Burn-in |
| WLP | Wafer-level Package |
| WLS | Weighted Least Squares |
| WLT | Wafer-level Test |
| WN | Tungsten Nitride |
| WNP | Waste Neutralization Plant |
| WORM | Write Once Read Many |
| WPC | Wafer Process Chamber |
| WPH | Wafers Per Hour |
| WSC | World Semiconductor Council |
| WSI | Wafer-scale Integration |
| WSPW | Wafer Starts Per Week |
| WTC | Wafer Transfer Chamber |
| WTW | Wafer-to-wafer |
| WTWNU | Wafer-to-wafer Nonuniformity |
| WVDS | Water Vapor Delivery System |
| WVR | Water Vapor Regained |