W |
Tungsten |
W-bit |
Wait-bit |
W/B |
Wire Bonding |
WAN |
Wide Area Network |
WB |
Weak Base |
WBS |
Work Breakdown Structure |
WBSEM |
Wire Bonder Specific Equipment Model |
WC |
Wedding Cake |
WCN |
Tungsten-carbon-nitride |
WD |
Working Distance |
WDM |
Wavelength Division Multiplex |
WDS |
Wavelength-dispersive Spectrometry |
WDX |
Wavelength Dispersive X-ray |
WDXA |
Wavelength-dispersive X-ray Analysis |
WEC |
Wafer Environment Control |
WFT |
Wafer Fabrication Template |
WIB |
Within-batch |
WIP |
Work In Process |
WIP |
Work In Progress |
WIS |
Wafer-induced Shift |
WIW |
Within-wafer |
WIWNU |
Within-wafer Nonuniformity |
WLBI |
Wafer-level Burn-in |
WLP |
Wafer-level Package |
WLS |
Weighted Least Squares |
WLT |
Wafer-level Test |
WN |
Tungsten Nitride |
WNP |
Waste Neutralization Plant |
WORM |
Write Once Read Many |
WPC |
Wafer Process Chamber |
WPH |
Wafers Per Hour |
WSC |
World Semiconductor Council |
WSI |
Wafer-scale Integration |
WSPW |
Wafer Starts Per Week |
WTC |
Wafer Transfer Chamber |
WTW |
Wafer-to-wafer |
WTWNU |
Wafer-to-wafer Nonuniformity |
WVDS |
Water Vapor Delivery System |
WVR |
Water Vapor Regained |