Semiconductor Technology
from A to Z
Everything about semiconductors and wafer fabrication
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Fundamentals
The atomic structure
The elements, the periodic table
Chemical bonds
Noble gases
Conductors – Insulators – Semiconductors
Doping: n- and p-semiconductors
The p-n junction
Transistors and Memory
Wafer Fabrication
Silicon
Production of raw silicon
Fabrication of the single crystal
The wafer
Doping techniques
Oxidation
Overview
Fabrication of oxide layers
LOCOS technology
Deposition
Plasma, the fourth aggregation state of a material
Chemical vapor deposition
Physical deposition methods
Metallization
Requirements on metallization
Aluminum technology
Copper technology
Metal semiconductor junction
Wiring
Photolithography
Exposure and resist coating
Exposition methods
Photoresist
Development and inspection
Photomasks
Optical Proximity Correction (OPC)
Wet Chemistry
Etch processes
Wet etching
Wafer cleaning
Dry Etching
Overview
Dry etch processes
Reactor Types
Compound Semiconductors and High-k Materials
Compound Semiconductors
Fundamentals & Material System
Crystal Growth & Substrates
SiC Power Devices
GaN Power Devices
Applications & System Comparison
Metrology
Film thickness measurement
Particle inspection
Wafer Test
Wafer Test
Final Test and Binning
Assembly
Dicing
Die Attach
Bonding
Encapsulation
Devices
Field-effect transistors
Bipolar transistors
Construction of a FinFET
DRAM Fabrication: The Trench Capacitor Process
Digital technology
From transistor to logic gate
The CMOS Fabrication Flow
The SRAM Cell
The DRAM Cell
The Flash Memory Cell
Design Rules
Layout versus Schematic (LVS)
Circuit Layouts
Micromechanics
Introduction to MEMS
Anisotropic Etching of Silicon
Sacrificial Layer Technique
Bulk vs. Surface Micromachining
The MEMS Accelerometer
The Microphone and Pressure Sensor
DRIE: Deep Reactive Ion Etching
Process Flow
Supply Chain
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11 nm
7 nm
5 nm
3 nm
2 nm
Akronyms
Statistics
Bit per euro (DRAM)
Evolution of the gate length of MOSFETs
Exposure wavelength vs. critical dimensions
FLOPS: floating point operations
Intel:AMD - CPU clock
Intel:AMD - Number of transistors
Intel:AMD - Process development
Manufacturing costs for different technology nodes
Manufacturing costs per transistor
Millions of instructions per second
Number of calculations per second per 1000 euro
Number of manufactured bits
Metallization
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Requirements on metallization
Aluminum technology
Aluminum and aluminum alloys
Diffusion in silicon
Electromigration
Hillocks
Copper technology
Copper technology
Damascene process
Low-k technology
Limits of copper wiring
Metal semiconductor junction
Contacting doped semiconductors
n-type semiconductor contact
p-type semiconductor contact
Band model of a p-n junction
Wiring
Multilayer wiring
BPSG reflow
Reflow back etching
Chemical mechanical polishing
Contacting the metallization layers
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Content
Fundamentals
Wafer Fabrication
Oxidation
Deposition
Metallization
Requirements on metallization
Aluminum technology
Copper technology
Metal semiconductor junction
Wiring
Photolithography
Wet Chemistry
Dry Etching
Compound Semiconductors
Metrology
Wafer Test
Assembly
Devices
Digital technology
Micromechanics