Infineon Technologies AG has agreed to sell its NOR Flash and F-RAM1. random access memoryMemory allowing individual locations to be accessed directly.2. reliability, availability, and maintainabilityReliability-engineering term describing device stress, aging or failure behavior. business to Winbond Electronics Corporation in an all-cash transaction valued at $1.12 billion on a cash- and debt-free basis. The deal covers a portfolio of NOR Flash memory and F-RAM1. random access memoryMemory allowing individual locations to be accessed directly.2. reliability, availability, and maintainabilityReliability-engineering term describing device stress, aging or failure behavior. products used in automotive, industrial and infrastructure markets.
The transaction is still subject to regulatory approvals, with closing targeted for the second half of 2027. Infineon said the divestment is intended to sharpen its portfolio and capital allocation around its core growth drivers.
Winbond, described as a global supplier of semiconductor memory solutions, will combine the acquired business with its existing memory portfolio. The company plans to run the unit as a standalone entity with headquarters in Silicon Valley in the United States.
Infineon stressed that it will continue to offer other specialty memory products, including SRAM1. static random access memoryMemory technology or system for temporarily or permanently storing digital information.2. static random-access memorySRAM is used here as a test vehicle for embedded memory performance., HYPERRAM, nvSRAM and SONOSsilicon/oxide/nitride/oxide/siliconMaterial or layer used in semiconductor processing, for example for insulation or surface passivation.-based radiation-hardened solutions. These remain part of the company’s portfolio for automotive, industrial, infrastructure, aerospace and defense applications, including high-reliability memory for space missions.
For Infineon, the sale marks a further shift away from NOR Flash and F-RAM1. random access memoryMemory allowing individual locations to be accessed directly.2. reliability, availability, and maintainabilityReliability-engineering term describing device stress, aging or failure behavior. and toward its broader power systems and IoTinternet of thingsThis term describes connected devices and systems that exchange data over networks. focus. Winbond, meanwhile, adds a complementary memory portfolio that broadens its product offering in a segment where both companies already operate.