EDN’s teardown series opens with TPteach pendant-Link’s TL-SM311LS, a 10 Gbit LX SFPstress-free polishingProcess for smoothing and flattening wafer or material surfaces.+ module intended for long-distance fiber links. The module is sold under TPteach pendant-Link’s business-focused Omada line and is specified for 9/125 μm single-mode fiber with reach up to 20 km. The article also notes that TPteach pendant-Link labels the device as a “Mini GBIC Module” rather than using the more common SFPstress-free polishingProcess for smoothing and flattening wafer or material surfaces. terminology.
Physically, the module follows the familiar SFPstress-free polishingProcess for smoothing and flattening wafer or material surfaces. form factor with a 20-contact edge connector, spring-loaded retention latch and a dust cap covering the optical ports. Once the outer shell is removed, the internal PCBprinted circuit boardBoard that mechanically supports components and electrically interconnects them with copper traces. and optical assembly become visible. The teardown documents the transmit and receive sides separately and shows how the retention tab and side tabs are used for insertion, locking and disassembly.
On the PCBprinted circuit boardBoard that mechanically supports components and electrically interconnects them with copper traces. underside, EDN identifies the optical receiver and the laser transmitter. Two small IC1. integrated circuitIC is the common term for an integrated circuit.2. ion chromatographyAnalytical method that separates and identifies the components of a mixture.s sit nearby: a GT24C08A-2ZLI, described as an 8 Kbit serial I²C EEPROMelectrically erasable programmable read only memory from Giantec Semiconductor, and a small dual-transistor device marked only with a code that could not be confirmed. The EEPROMelectrically erasable programmable read only memory is presented as part of the configuration memory commonly found in third-party SFPstress-free polishingProcess for smoothing and flattening wafer or material surfaces. modules.
The main active device on the board is a 28-pin QFN marked “3320C”, identified as the Uxfastic UX3320 from Xiamen UX High-Speed IC1. integrated circuitIC is the common term for an integrated circuit.2. ion chromatographyAnalytical method that separates and identifies the components of a mixture.. EDN describes it as a G/EPON ONU fiber transceiver and infers that it likely integrates the SFPstress-free polishingProcess for smoothing and flattening wafer or material surfaces. interface functions on the same device, given the lack of other control logic on the PCBprinted circuit boardBoard that mechanically supports components and electrically interconnects them with copper traces..
The teardown closes by placing the module in context as a conventional 1 Gbps SFPstress-free polishingProcess for smoothing and flattening wafer or material surfaces. design, despite the SFPstress-free polishingProcess for smoothing and flattening wafer or material surfaces.+ label in the article title and product family naming. EDN frames it as one point in a broader comparison series that will later include higher-bitrate SFPstress-free polishingProcess for smoothing and flattening wafer or material surfaces., SFPstress-free polishingProcess for smoothing and flattening wafer or material surfaces.+ and QSFP+ modules, as well as multimode variants.