IC-ThermBench benchmark targets comparable thermal ML models for 2.5D and 3D ICs

September 19, 2026

IC-ThermBench benchmark targets comparable thermal ML models for 2.5D and 3D ICs

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Researchers from the University of Technology Sydney, ShanghaiTech University, and the Technical University of Munich have published IC1. integrated circuitIC is the common term for an integrated circuit.2. ion chromatographyAnalytical method that separates and identifies the components of a mixture.-ThermBench, an open benchmark aimed at making thermal-learning models for 2.5D and 3D IC1. integrated circuitIC is the common term for an integrated circuit.2. ion chromatographyAnalytical method that separates and identifies the components of a mixture.s more directly comparable. The work is framed around temperature prediction in advanced package architectures, where different model approaches often face different task setups and physical conditions.

The benchmark brings together established 3D-IC3D Integrated Circuit3D-IC refers to integrated circuits with three-dimensionally stacked components. steady-state, transient, and industrial package tasks. In addition, it adds a new 2.5D chiplet extension with 50,000 samples. According to the paper, this extension is intended to broaden the range of represented physical variation and to test cross-package out-of-distribution transfer.

By combining multiple task types in one open benchmark, IC1. integrated circuitIC is the common term for an integrated circuit.2. ion chromatographyAnalytical method that separates and identifies the components of a mixture.-ThermBench creates a common reference point for evaluating generalization across package classes rather than only performance on a single thermal scenario. The authors present it as a progressive benchmark, meaning that it is structured to cover increasingly broad thermal-learning settings.

The paper, titled “IC1. integrated circuitIC is the common term for an integrated circuit.2. ion chromatographyAnalytical method that separates and identifies the components of a mixture.-ThermBench: An Open, Progressive Benchmark for Generalizable 2.5D/3D-IC1. integrated circuitIC is the common term for an integrated circuit.2. ion chromatographyAnalytical method that separates and identifies the components of a mixture. Thermal Learning,” is published as an arXiv preprint. It focuses on comparison and transferability in ML-based thermal modeling for advanced IC1. integrated circuitIC is the common term for an integrated circuit.2. ion chromatographyAnalytical method that separates and identifies the components of a mixture. packages, with the 2.5D chiplet dataset extension as its main new contribution.

Source: Semiconductor Engineering

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