Semiconductor Technology
from A to Z
Everything about semiconductors and wafer fabrication
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Fundamentals
The atomic structure
The elements, the periodic table
Chemical bonds
Noble gases
Conductors – Insulators – Semiconductors
Doping: n- and p-semiconductors
The p-n junction
Field-effect transistors
Bipolar transistors
Construction of a FinFET
Wafer Fabrication
Silicon
Production of raw silicon
Fabrication of the single crystal
The wafer
Doping techniques
Oxidation
Overview
Fabrication of oxide layers
LOCOS technology
Film thickness measurement
Deposition
Plasma, the fourth aggregation state of a material
Chemical vapor deposition
Physical deposition methods
Metallization
Requirements on metallization
Aluminum technology
Copper technology
Metal semiconductor junction
Wiring
Photolithography
Exposure and resist coating
Exposition methods
Photoresist
Development and inspection
Photomasks
Wet Chemistry
Etch processes
Wet etching
Wafer cleaning
Dry Etching
Overview
Dry etch processes
Wafer Test
Wafer Test
Final Test and Binning
Assembly
Dicing
Die Attach
Bonding
Encapsulation
Process Flow
Supply Chain
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1000 nm
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600 nm
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250 nm
180 nm
130 nm
90 nm
65 nm
45 nm
32 nm
22 nm
16 nm
11 nm
7 nm
5 nm
3 nm
2 nm
Akronyms
Statistics
Bit per euro (DRAM)
Evolution of the gate length of MOSFETs
Exposure wavelength vs. critical dimensions
FLOPS: floating point operations
Intel:AMD - CPU clock
Intel:AMD - Number of transistors
Intel:AMD - Process development
Manufacturing costs for different technology nodes
Manufacturing costs per transistor
Millions of instructions per second
Number of calculations per second per 1000 euro
Number of manufactured bits
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ZCC
Zone Control Conveyor
Zn
Zinc
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Zirconium
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