Applied Materials is increasing its investment in BE Semiconductor Industries N.V. to roughly 20 percent of Besi’s outstanding shares, extending a strategic relationship that began in 2020 and was first expanded when Besi joined Applied Materials’ EPIC1. Equipment and Process Innovation and CommercializationApplied Materials uses this name for its new collaborative R&D center.2. Electronics, Photonics and Integrated CircuitsEPIC names the collaboration center unveiled by Applied Materials. Center as an Innovation Partner.
The transaction builds on Applied Materials’ initial investment from April 2025. The company entered into an accelerated share purchase agreement for the additional Besi shares, with delivery subject to the expiry or termination of the applicable waiting period under the HSR Act.
The broader collaboration now goes beyond hybrid bonding into new interconnect architectures and applications tied to the semiconductor industry’s AIartificial intelligence-driven scaling roadmap. Stated focus areas include next-generation 3D IC1. integrated circuitIC is the common term for an integrated circuit.2. ion chromatographyAnalytical method that separates and identifies the components of a mixture. scaling, logic and memory integration, scaling of thermo-compression bonding, and new die-on-wafer, die-on-die, and die-on-panel integration platforms.
Applied Materials said it views the investment as long term and does not intend to raise its holding beyond approximately 20 percent. The company also said it does not intend to seek board representation at Besi.
Hybrid bonding and next-generation interconnect architectures are described as increasingly important for energy-efficient AIartificial intelligence compute performance. The announcement does not provide further technical details on the specific equipment or process changes linked to the expanded partnership.