Applied Materials has announced a collaboration with KIOXIA at its EPIC1. Equipment and Process Innovation and CommercializationApplied Materials uses this name for its new collaborative R&D center.2. Electronics, Photonics and Integrated CircuitsEPIC names the collaboration center unveiled by Applied Materials. Center in Silicon Valley to advance next-generation memory technologies. The partnership is centered on memory-cell and structure creation, multi-chip stacking architectures and materials engineering work intended to raise memory density and performance for AIartificial intelligence workloads.
The companies say the joint R&D effort will focus on the core challenges of scaling memory for AIartificial intelligence infrastructure: higher density, greater bandwidth and improved energy efficiency. Applied Materials frames the work as a combination of its materials engineering expertise with KIOXIA’s experience in flash memory and SSD1. Solid State Drivenon-volatile electronic storage medium, usually a hard disk drive in computers2. Solid-State DriveA non-volatile storage device used in the rack demo to hold full KV caches.s, with both teams working side by side inside the EPIC1. Equipment and Process Innovation and CommercializationApplied Materials uses this name for its new collaborative R&D center.2. Electronics, Photonics and Integrated CircuitsEPIC names the collaboration center unveiled by Applied Materials. Center environment.
According to the announcement, the collaboration also extends beyond device structures to packaging-related innovation. KIOXIA says the goal is to accelerate breakthroughs in memory and packaging technologies that can deliver higher integration and performance for AIartificial intelligence computing, while Applied highlights the role of materials, equipment and process technology in managing cost and complexity.
The EPIC1. Equipment and Process Innovation and CommercializationApplied Materials uses this name for its new collaborative R&D center.2. Electronics, Photonics and Integrated CircuitsEPIC names the collaboration center unveiled by Applied Materials. Center itself is presented as a major U.S. R&D investment for advanced semiconductor equipment, with a planned scale of about $5 billion over time. Applied says the facility is designed to shorten the path from early research to high-volume manufacturing by giving chipmakers earlier access to its R&D portfolio and by enabling faster learning cycles in a secure collaborative setting.