BIWIN will use electronica 2026 to highlight storage designs targeted at very different system classes, from AIartificial intelligence data infrastructure to edge devices and vehicles. The portfolio spans enterprise SSD1. Solid State Drivenon-volatile electronic storage medium, usually a hard disk drive in computers2. Solid-State DriveA non-volatile storage device used in the rack demo to hold full KV caches.s, embedded memory, industrial drives and compact removable storage, with each product family tuned to a specific workload profile rather than a single universal design.
At the high end, BIWIN’s PCIePeripheral Component Interconnect ExpressPCIe is the high-speed serial interconnect standard 5.0 enterprise SSD1. Solid State Drivenon-volatile electronic storage medium, usually a hard disk drive in computers2. Solid-State DriveA non-volatile storage device used in the rack demo to hold full KV caches. line includes the SP509/SP519 series for AIartificial intelligence training and inference workloads. These PCIePeripheral Component Interconnect ExpressPCIe is the high-speed serial interconnect standard Gen5 x4 drives are specified for sequential read and write speeds of up to 14,700/9,000 MBmachine batch/s and 4K random performance of up to 3,200K/800K IOPS. The SP5002 uses high-density QLC NANDNot ANDA logic gate that outputs 0 when all inputs are 1, and outputs 1 in all other cases and reaches up to 61.44 TBtied body in EDSFF formats, while the SP5010, a 2.5-inch U.2 PCIePeripheral Component Interconnect ExpressPCIe is the high-speed serial interconnect standard Gen5 x4 SSD1. Solid State Drivenon-volatile electronic storage medium, usually a hard disk drive in computers2. Solid-State DriveA non-volatile storage device used in the rack demo to hold full KV caches., scales to 122.88 TBtied body per drive. The SP506/SP516 series combines PCIePeripheral Component Interconnect ExpressPCIe is the high-speed serial interconnect standard 5.0 performance with OCPOpen Compute Projectan initiative for the standardization and open design of data center hardware 2.0 compliance and high performance per watt.
BIWIN also positions storage around integration density. The ePoP5X combines LPDDR5X memory and eMMC storage in a Package-on-Package design to reduce PCBprinted circuit boardBoard that mechanically supports components and electrically interconnects them with copper traces. space and support compact industrial devices, AIartificial intelligence glasses and similar space-limited hardware. For removable storage, the BL130 Mini SSD1. Solid State Drivenon-volatile electronic storage medium, usually a hard disk drive in computers2. Solid-State DriveA non-volatile storage device used in the rack demo to hold full KV caches. brings PCIePeripheral Component Interconnect ExpressPCIe is the high-speed serial interconnect standard Gen4 into an ultra-compact form factor with sequential read speeds up to 3,700 MBmachine batch/s and capacities up to 2 TBtied body.
For industrial and edge environments, the TGS601 is built for sustained, always-on workloads. Its Win-REC write algorithm is designed for continuous video recording, and a single drive can handle up to 24 simultaneous video streams while maintaining consistent write performance. The drive also supports operation from -40°C to 85°C, includes full-capacity onboard DRAM1. dynamic random access memoryMemory technology or system for temporarily or permanently storing digital information.2. dynamic random-access memoryDRAM is a volatile memory technology, hardware-based power-loss protection and multi-layer data protection.
BIWIN’s automotive portfolio covers intelligent cockpits, infotainment, navigation, digital instrument clusters, T-BOXburied oxideMaterial or layer used in semiconductor processing, for example for insulation or surface passivation. modules and domain controllers. The TAU208 UFS 3.1 includes a Deep Sleep mode that can cut sleep power consumption by up to 95%, along with Performance Throttling Notification and Error History logging. The TAE308 eMMC 5.1 uses BIWIN’s self-developed controller, is qualified to AECAdvanced Equipment ControllerControl unit for monitoring or regulating a technical process or piece of equipment.-Q100 Grade 2, and is specified for operation from -40°C to 105°C.
The company frames the portfolio around application-specific optimization across enterprise, industrial, automotive and compact consumer systems. The common thread is storage architecture that is shaped by workload, density, power and integration constraints rather than by a one-size-fits-all approach.
BIWIN will show the products at electronica 2026 in Hall C6, Booth 140, from November 10-13 in Munich.