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October 16, 2026 Supply Chain & Sites

TSMC and GlobalFoundries Point to a Growing Market for Mature Nodes in Advanced AI Packaging

TSMC and GlobalFoundries are drawing attention to a fast-expanding market in which mature wafer processes support advanced packaging rather than leading-edge logic. Silicon interposers, through-silicon vias, and embedded deep trench capacitors are emerging as the main demand drivers for this capacity, creating a sizable opportunity around older process nodes.

Read more → · Advanced Packaging