Samsung Electronics has reportedly started front-end wafer mass production of its next-generation Exynos 2700 mobile application processor. The planned production volume is said to exceed that of the Exynos 2600 by more than 10%, indicating a notable scale-up for Samsung’s in-house mobile silicon.
The move comes as Samsung prepares to expand the use of Exynos chips across the Galaxy S27 lineup. The production step is described as front-end wafer mass production, placing the device at an early manufacturing stage before back-end processing and final assembly.
The report also ties the ramp to Samsung’s second-generation 2nm rollout. No further process details, performance targets, or yield figures were given. Still, the larger wafer volume suggests Samsung is increasing confidence in its next Exynos generation and its ability to support broader device deployment.