SK hynix used TSMCTaiwan Semiconductor Manufacturing CompanyTSMC is named as a founding partner of the EPIC Center.’s Open Innovation Platform Conference in Santa Clara to present its next-generation memory portfolio and development strategy for AIartificial intelligence systems. The company also confirmed its close cooperation with TSMCTaiwan Semiconductor Manufacturing CompanyTSMC is named as a founding partner of the EPIC Center. by receiving the Partner of the Year Award for the second consecutive year.
The booth centered on AIartificial intelligence memory and storage, with SK hynix positioning HBM1. human body modelESD test model that simulates a person discharging static electricity into a component.2. High Bandwidth MemoryHBM is a stacked DRAM architecture designed to provide very high memory bandwidth., server DRAM1. dynamic random access memoryMemory technology or system for temporarily or permanently storing digital information.2. dynamic random-access memoryDRAM is a volatile memory technology and eSSD as layers that support both computation and data movement. On display were products already deployed in AIartificial intelligence accelerators as well as the next steps in the lineup, including 12-layer 36GB HBM4 on NVIDIA’s Vera Rubin superchip, 12-layer 48GB HBM4EHigh Bandwidth Memory, 4. Generation, 16-layer 48GB HBM4 and 12-layer 36GB HBM3E. SK hynix also showed SOCAMM2 modules, including a 192GB unit.
On the server memory side, the company highlighted a 256GB 3DS RDIMMregistered dual in-line memory moduleRDIMMs are server memory modules that use a register to improve signal integrity., a 128GB MRDIMM1. Multiplexed Rank Dual Inline Memory ModuleA server memory module form factor2. Multi-Load Reduced DIMMA server Memory module for higher capacity and a 64GB RDIMMregistered dual in-line memory moduleRDIMMs are server memory modules that use a register to improve signal integrity. built on a 10-nanometer-class sixth-generation 1c process. For storage, SK hynix presented the PEB210 E1.S, PS1101 E3Early Equipment Evaluation.S and PEB210 M.2. The E1.S model supports direct liquid cooling, while the PS1101 E3Early Equipment Evaluation.S was described as the company’s first QLC-based eSSD.
In a joint presentation with Cadence, SK hynix also discussed PCIePeripheral Component Interconnect ExpressPCIe is the high-speed serial interconnect standard trends for HPC1. High Performance ComputingCompute applications with particularly high performance demands, cited here as a driver for packaging and testing.2. high-performance computingHPC denotes compute-intensive chips that require advanced testing support. and AIartificial intelligence storage. The company said PCIePeripheral Component Interconnect ExpressPCIe is the high-speed serial interconnect standard generations have arrived every two to three years since the fourth generation, with bandwidth doubling each time, and that power optimization plus tighter design-process collaboration become more important from the sixth generation onward. SK hynix expects demand for PCIePeripheral Component Interconnect ExpressPCIe is the high-speed serial interconnect standard-based eSSD to rise sharply as AIartificial intelligence infrastructure expands.
For sixth- and seventh-generation PCIePeripheral Component Interconnect ExpressPCIe is the high-speed serial interconnect standard storage, SK hynix said it is preparing SSD1. Solid State Drivenon-volatile electronic storage medium, usually a hard disk drive in computers2. Solid-State DriveA non-volatile storage device used in the rack demo to hold full KV caches. solutions based on chiplets. The concept splits the traditional single-chip controller into chiplet units connected through UCIeUniversal Chiplet Interconnect ExpressUCIe is a die-to-die interconnect standard that can carry packetized chiplet traffic., which the company says could shorten development time, allow functions to move across generations independently, expand capacity and improve power optimization.