Applied Materials and Intel are expanding joint development on chipmaking technologies for AIartificial intelligence-driven computing, focusing on next-generation transistors, interconnects and advanced packaging. The collaboration brings together Applied’s EPIC1. Equipment and Process Innovation and CommercializationApplied Materials uses this name for its new collaborative R&D center.2. Electronics, Photonics and Integrated CircuitsEPIC names the collaboration center unveiled by Applied Materials. Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon, with the aim of accelerating the transfer of new technologies into manufacturing.
The companies are working on next-generation materials, process technologies and device architectures for advanced logic nodes targeting AIartificial intelligence workloads. The program covers both front-end and back-end-of-line advances, including interconnect scaling, which remains central as process nodes become more complex.
Packaging is a second major pillar of the effort. The collaboration includes development work for Foveros-based 3D stacking, intended to increase interconnect density, improve power delivery and strengthen thermal performance for high-performance compute platforms. Those systems are being positioned for emerging agentic AIartificial intelligence workloads.
Applied says the EPIC1. Equipment and Process Innovation and CommercializationApplied Materials uses this name for its new collaborative R&D center.2. Electronics, Photonics and Integrated CircuitsEPIC names the collaboration center unveiled by Applied Materials. Center was designed to reduce the time needed to commercialize breakthrough technologies, giving chipmakers earlier access to its R&D portfolio and faster learning cycles. Intel frames the collaboration as part of its effort to keep pace with rising AIartificial intelligence infrastructure demand and to move new materials and process innovations more quickly toward high-volume manufacturing in the United States.
The two companies describe the partnership as a long-running one that now adds a more tightly integrated development environment. Further technical details were not provided.