Applied Materials has added the UCLA Samueli School of Engineering as a research partner at its EPIC1. Equipment and Process Innovation and CommercializationApplied Materials uses this name for its new collaborative R&D center.2. Electronics, Photonics and Integrated CircuitsEPIC names the collaboration center unveiled by Applied Materials. Center in Silicon Valley, expanding the facility’s role as a bridge between academic semiconductor research and industrial-scale development. The joint program is intended to move new chip technologies from early-stage ideas into commercialization more quickly.
Researchers from UCLA will work alongside Applied Materials scientists and engineers on semiconductor materials and integration challenges. A central goal is to validate and test new concepts in a commercial fab environment, using advanced chipmaking tools available at the center.
The collaboration is structured around R&D programs that target some of the industry’s most demanding problems. These include 3D chip scaling, advanced packaging and the discovery of new materials aimed at improving energy-efficient AIartificial intelligence compute performance. UCLA Samueli brings established expertise in semiconductor devices, materials, electronics and computing, as well as the CHIPS Lab focused on heterogeneous integration and performance scaling.
Applied describes the EPIC1. Equipment and Process Innovation and CommercializationApplied Materials uses this name for its new collaborative R&D center.2. Electronics, Photonics and Integrated CircuitsEPIC names the collaboration center unveiled by Applied Materials. Center as its new Equipment and Process Innovation and Commercialization facility and says it represents the largest-ever U.S. investment in advanced semiconductor equipment R&D. The site is designed to reduce the time needed to commercialize breakthrough technologies and is on track to become operational in 2026.