GlobalFoundries has signed a manufacturing agreement with TSMCTaiwan Semiconductor Manufacturing CompanyTSMC is named as a founding partner of the EPIC Center. to establish a U.S.-based supply of silicon interposers for TSMCTaiwan Semiconductor Manufacturing CompanyTSMC is named as a founding partner of the EPIC Center.’s CoWoS advanced packaging ecosystem. Under the deal, GF will provide manufacturing services to TSMCTaiwan Semiconductor Manufacturing CompanyTSMC is named as a founding partner of the EPIC Center. and expand fabrication capacity at its Malta, New York site.
The company says the additional capacity is intended to support demand for high-performance computing and AIartificial intelligence systems. It also describes the arrangement as a foundation for further capacity expansion as customer demand grows. The agreement has an initial term of five years and a total value of $2 billion.
GF expects the Malta site to become the first U.S.-based source of silicon interposers supporting advanced packaging technologies. The buildout also includes embedded deep trench capacitor components, extending the scope of the manufacturing flow beyond the interposer itself.
Volume production is expected to begin ramping in the first half of 2028. GF says the added manufacturing capacity should improve scale and flexibility for advanced packaging solutions across multiple product generations.
The agreement reflects the growing role of advanced packaging in AIartificial intelligence hardware, where interposers and related components are becoming central to performance, power efficiency and system scale. No further technical details about process nodes or interposer specifications were provided.