News – Devices & Products

October 29, 2026 Devices & Products

GreenPAK targets deterministic multi-rail power sequencing in compact hardware

Programmable mixed-signal ICs can replace bulky RC timing networks and firmware-dependent startup logic with deterministic multi-rail sequencing. GreenPAK devices combine counters, lookup tables, comparators, state machines, and GPIO routing to control regulator enables, qualify power-good signals, verify rail thresholds, latch faults, and manage orderly shutdown without relying on processor firmware.

Automotive Sensor Supply Eliminates Switching Pre-Regulator by Gating the LDO

A discrete automotive sensor supply design removes the usual DC-DC pre-regulator and instead keeps the linear pass stage off for most of the time. A CPU pin both monitors the output and disables the supply, while a transistor-based short-circuit trip and automotive battery protection remain in place.

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October 6, 2026 Devices & Products

Continuity testing establishes the first electrical check in semiconductor ATE

Continuity testing is the first step in a semiconductor test flow. It verifies that the DUT is correctly connected to the ATE by checking for opens and shorts and by using the expected behavior of the device’s ESD protection diodes to confirm the pin path.

Samsung ramps Exynos 2700 wafer production on second-generation 2nm nodes

Samsung Electronics has reportedly started front-end wafer mass production of the Exynos 2700 mobile application processor. Planned output is set at more than 10% above the Exynos 2600 as Samsung prepares broader use of its in-house chips across the Galaxy S27 lineup.

Space-rated analog ICs are moving from custom builds to catalog parts

Space-qualified analog ICs are no longer limited to expensive, order-to-build programs. Vendors are increasingly listing basic analog functions such as current sensing, buffering, and temperature measurement as standard catalog items, reducing schedule risk and cost for satellite designers.

Infineon adds PQC to real-time MCUs for power conversion and motor control

Infineon’s PSoC Control C3 Performance Line combines dual-core Arm Cortex-M33 operation at up to 200 MHz with a programmable power control accelerator, WBG readiness, and post-quantum cryptography for secure firmware handling in demanding power and motor applications.

60 GHz radar enables low-power presence sensing in IoT devices

A 60 GHz FMCW radar front end can keep track of occupancy and motion while leaving the host MCU, camera, or other higher-power blocks asleep. Infineon’s XENSIV BGT60CUTR13AIP is used as an example of how antenna-in-package integration and on-chip processing reduce standby power in battery-powered IoT designs.

Inside a 10 Gbit LX SFP+ single-mode transceiver

EDN’s teardown of TP-Link’s TL-SM311LS examines a long-range fiber module marketed as an LX “Mini GBIC Module”. The inspection identifies the optical receiver and laser transmitter, along with an EEPROM from Giantec Semiconductor and a G/EPON ONU transceiver from Xiamen UX High-Speed IC.

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September 17, 2026 Devices & Products

ST launches 1.1-MP infrared image sensor for in-cabin monitoring

STMicroelectronics’ SafeSense VD56GA targets driver and occupant monitoring with a 1.1-megapixel infrared sensor based on DeepNIR BSI pixels. The company says the part improves sharpness and sensitivity while reducing camera-module complexity and space requirements.

September 17, 2026 Devices & Products

Singular Photonics unveils a CMOS SPAD sensor with in-pixel photon processing

Singular Photonics has introduced Litavis, a CMOS single-photon avalanche diode image sensor that performs digital photon processing directly on-chip and within the pixel. The company says the architecture is aimed at reducing data traffic, latency, and power while supporting low-light imaging and time-resolved capture.

September 17, 2026 Devices & Products

SFP Modules Link Copper and Fiber in a Compact Hot-Swappable Form Factor

SFP and its higher-speed variants have become a compact, hot-swappable interface for networking gear that can bridge copper, direct-attach cabling, and optical fiber. The module family spans legacy GBIC and XFP concepts as well as SFP, SFP+, QSFP, and cSFP options, each trading density, speed, and reach in different ways.

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September 16, 2026 Devices & Products

Infineon launches PSOC Control C3 Performance Line with post-quantum security

Infineon has introduced the PSOC Control C3 Performance Line MCU family for real-time power and motor control. The new devices combine high switching-frequency control, analog support, and PQC-ready firmware protection in a Cortex-M33-based architecture.

Infineon launches OPTIREG TLE9744QK PMIC for traction inverters

Infineon has introduced the OPTIREG TLE9744QK, a fully integrated PMIC for high-voltage traction inverter ECUs in HEVs and EVs. The device combines power-supply functions, resolver excitation, and an independent safety engine in one chip, while reducing component count and PCB area.

Infineon launches 120 V dual gate driver for dense AI server power stages

Infineon has introduced the EiceDRIVER 2EDL6014AC-G2D, a compact dual-channel floating gate driver aimed at high-density power conversion in AI datacenter hardware. The 120 V device combines independent high-side control, strong source and sink drive, and thermal features for continuous server workloads.

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September 16, 2026 Devices & Products

Infineon unveils dual-phase smart power stages for AI accelerators

Infineon has introduced the TDA235E5 and TDA235E0, a dual-phase smart power stage family for next-generation AI accelerators and vertical power delivery modules. The devices combine OptiMOS 6 MOSFETs with a dual-phase driver IC in a compact package and are rated for more than 2 A/mm² power density.