Short updates from the semiconductor industry, with context and links to the relevant chapters. RSS
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September 15, 2026 Artificial intelligence
Redundant power feeds keep AI data centers online, but they also leave usable capacity idle. The result is a tension between uptime, power efficiency, and the ability to add more hardware without building new infrastructure.
September 15, 2026 Design & EDA
Operating a SoC near or below MOSFET threshold voltage changes the design rules. The article outlines why standard low-power libraries, coarse corner models, and ordinary test flows are not enough in the ultra-low-voltage regime.
September 15, 2026 Design & EDA
AI is starting to assist both hardware and software development, but integrated co-design still runs into organizational silos, mismatched tools, and the lack of models that are fast enough and accurate enough for continuous iteration.
September 15, 2026 Companies & Market
Yole Group expects the semiconductor market to grow to nearly four times today’s revenue by 2031, even though shipped silicon volume will rise only slightly. The forecast points to pricing power as the key economic lever behind the AI buildout.
September 15, 2026 Circuit Design & Applications
An EDN analysis compares clustered and spread-bit PWM as DAC implementations and shows that the theoretical settling-time advantage of spread-bit modulation can shrink sharply once microcontroller timing, jitter, and output-stage errors are included.
September 15, 2026 Circuit Design & Applications
Autonomous mobile robots are reshaping manufacturing, warehousing, and logistics, with semiconductor-based sensing, compute, and communications forming the technical backbone.
September 15, 2026 Design & EDA
Rising power density and chiplet complexity are pushing thermal management into earlier design stages, with engineers now balancing chip, package, board, and system effects in a single multi-physics flow.
September 15, 2026 Artificial intelligence
Rambus has introduced CryptoManager Root of Trust, a production-ready security IP package for data center and AI SoCs. The solution combines a secure RISC-V processor, protected memory, secure key and data storage, cryptographic accelerators, and interfaces, while operating alongside an unmodified open-source Caliptra core.
September 15, 2026 Devices & Products
Rising AI cluster performance is pushing architects toward hybrid PCIe topologies that can link accelerators and shared resources across servers and, in some cases, across racks. Switches provide fan-out and traffic control, while retimers extend electrical reach where signal integrity becomes harder to maintain.
September 15, 2026 Artificial intelligence
A potential FCC import restriction on optical networking components from China could create bottlenecks for hyperscalers that rely on high-speed optics to expand AI data centers.
September 15, 2026 Companies & Market
At the AI Infra Summit, NVIDIA outlined its upcoming Vera Rubin platform and DSX rack concepts as part of a push to optimize AI data centers around tokens per watt rather than peak performance alone. The company tied the approach to full-stack integration across systems, networking, software and power management.
September 16, 2026 Devices & Products
Infineon has introduced the TDA235E5 and TDA235E0, a dual-phase smart power stage family for next-generation AI accelerators and vertical power delivery modules. The devices combine OptiMOS 6 MOSFETs with a dual-phase driver IC in a compact package and are rated for more than 2 A/mm² power density.
September 16, 2026 Companies & Market
Infineon Technologies Asia Pacific and Tack One have been recognized by the Singapore International Chamber of Commerce for co-developing FloodFinder™, a self-sustaining flood monitoring system that combines semiconductor sensing with ultra-low-power IoT system design.
September 16, 2026 Companies & Market
Infineon Technologies AG says radiation-hardened HiRel power devices are part of the power system on NASA’s Nancy Grace Roman Space Telescope, which has now launched toward the L2 orbit. The mission places qualification depth, radiation tolerance and long-term availability at the center of the component choice.
September 16, 2026 Companies & Market
Infineon is delivering 1200 V CoolSiC MOSFETs to Fox ESS for residential energy storage systems. The partnership targets lower switching losses, higher efficiency and improved thermal performance in hybrid inverter and battery designs.