Short updates from the semiconductor industry, with context and links to the relevant chapters. RSS
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September 16, 2026 Companies & Market
Infineon Technologies has agreed to divest its NOR Flash and F-RAM business to Winbond Electronics in an all-cash transaction valued at $1.12 billion. The company says the move will let it concentrate more strongly on power semiconductors and other core growth areas.
September 16, 2026 Devices & Products
Infineon has introduced the EiceDRIVER 2EDL6014AC-G2D, a compact dual-channel floating gate driver aimed at high-density power conversion in AI datacenter hardware. The 120 V device combines independent high-side control, strong source and sink drive, and thermal features for continuous server workloads.
September 16, 2026 Devices & Products
Infineon has introduced the OPTIREG TLE9744QK, a fully integrated PMIC for high-voltage traction inverter ECUs in HEVs and EVs. The device combines power-supply functions, resolver excitation, and an independent safety engine in one chip, while reducing component count and PCB area.
September 16, 2026 Devices & Products
Infineon has introduced the PSOC Control C3 Performance Line MCU family for real-time power and motor control. The new devices combine high switching-frequency control, analog support, and PQC-ready firmware protection in a Cortex-M33-based architecture.
September 17, 2026 Manufacturing & Processes
onsemi has introduced an Embedded Power Platform that uses the silicon wafer itself as the package foundation, embedding multiple dies and combining electrical, thermal, and mechanical co-design to raise power density in AI and automotive power systems.
September 17, 2026 Devices & Products
SFP and its higher-speed variants have become a compact, hot-swappable interface for networking gear that can bridge copper, direct-attach cabling, and optical fiber. The module family spans legacy GBIC and XFP concepts as well as SFP, SFP+, QSFP, and cSFP options, each trading density, speed, and reach in different ways.
September 17, 2026 Devices & Products
Singular Photonics has introduced Litavis, a CMOS single-photon avalanche diode image sensor that performs digital photon processing directly on-chip and within the pixel. The company says the architecture is aimed at reducing data traffic, latency, and power while supporting low-light imaging and time-resolved capture.
September 17, 2026 Devices & Products
STMicroelectronics’ SafeSense VD56GA targets driver and occupant monitoring with a 1.1-megapixel infrared sensor based on DeepNIR BSI pixels. The company says the part improves sharpness and sensitivity while reducing camera-module complexity and space requirements.
September 17, 2026 Companies & Market
GlobalFoundries and Marvell have widened their multi-year collaboration to increase capacity for GF’s silicon germanium technology, targeting next-generation optical links for AI data centers and network infrastructure.
September 18, 2026 Industry & People
A community post on EDN gathers small but useful habits from day-to-day engineering work, from thorough documentation to involving repair teams and machinists early in a design.
September 18, 2026 Circuit Design & Applications
Cosmic radiation and alpha particles can still flip bits in FPGA configuration memory outside space systems. The article outlines how modern designs combine CRAM readback, scrubbing, ECC, and triple modular redundancy to detect and recover from these upsets.
September 18, 2026 Industry & People
India is advancing on several fronts at once, from the India Semiconductor Mission 2.0 to quantum computing collaborations with IBM and work on neuromorphic chips. The country is building out a domestic semiconductor industry across policy, research, and emerging device areas.
September 18, 2026 Industry & People
This week’s industry roundup highlights a major memory deal, new U.S. capacity plans, progress toward 2 nm and below, and Huawei’s renewed push into chip manufacturing. The report also touches on data-center and AI SoC reliability work, Chinese equipment makers gaining share, India’s build-out, and funding activity across the semiconductor ecosystem.
September 19, 2026 Research
Researchers at Peking University have proposed an experimentally derived framework that predicts thermal conductivity in complex BEOL interconnect stacks from their structure. The model combines layer-resolved time-domain thermoreflectance data with statistical analysis and a three-dimensional in-layer conductivity description.
September 19, 2026 Design & EDA
Researchers at Purdue University have introduced DRC-Aid, a closed-loop agentic framework that repairs local design-rule violations with an inference-time large language model while preserving layout equivalence. The system turns verification output into a bounded set of geometric edits and searches for fixes inside that constrained space.