Short updates from the semiconductor industry, with context and links to the relevant chapters. RSS
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September 4, 2026 Research
Research reports this week highlighted a room-temperature 2D tunnel transistor, a fully in-memory photonic computing chip from Tsinghua University, and a series of funding and education moves tied to quantum, packaging, and semiconductor skills. The roundup also touched on GaN power devices, defect-pattern AI, and India’s $13.4 billion Semicon 2.0 initiative.
September 7, 2026 Devices & Products
Automotive coolant level sensors do more than trigger a warning lamp. EDN explains how float, optical, capacitive, resistive, and ultrasonic approaches detect low coolant before overheating can damage engines, EV battery packs, or cooling loops.
September 8, 2026 Circuit Design & Applications
A radio receiver’s ADC choice is no longer only about sampling rate. With embedded DSP blocks that handle decimation, digital downconversion, and IQ correction, the balance between analog filtering, data rate, and FPGA load shifts in measurable ways.
September 8, 2026 Research
Three research efforts point to new approaches for ultra-thin interconnect insulation, 600 C SiC logic devices, and more stable oxide vertical channel transistors for compute-in-memory.
September 8, 2026 Circuit Design & Applications
EDN compares several third-order active Butterworth filter topologies, from ideal and Sallen-Key versions to emitter-follower and DC-accurate implementations, and contrasts simulations with lab Bode measurements.
September 8, 2026 Research
Semiconductor Engineering’s latest paper roundup spans HBF for LLM inference, monolithically integrated M3D SRAM with BEOL pass-gates at 2nm, hybrid HBM-HBF memory, GaN-on-silicon polarization superjunctions, programmable silicon photonics, distributed GPU architectures, and Al dopant activation in 4H-SiC.
September 8, 2026 Circuit Design & Applications
From milliwatt diode lasers to high-power material processing systems, the performance of the power supply is a key factor for stability and service life.
September 8, 2026 Artificial intelligence
AI-assisted programming tools are being promoted as a way to speed up IoT software development, yet experts caution against assuming large productivity gains without evidence.
September 8, 2026 Research
imec and its material partners have demonstrated that chemically amplified resists can still support single-exposure High-NA EUV patterning at 22-nm pitch, including tight-pitch logic lines, vias, and SRAM-related structures relevant to A14/A10 nodes.
September 8, 2026 Companies & Market
GlobalFoundries has finalized a $375 million agreement with the U.S. Department of Commerce to expand domestic quantum semiconductor manufacturing and move quantum chips closer to commercial-scale production.
September 8, 2026 Manufacturing & Processes
Samsung Electronics is joining an industry initiative for a new 12-inch photomask platform and plans to introduce ASML’s High-NA EUV lithography into future DRAM high-volume manufacturing by 2028.
September 9, 2026 Companies & Market
GlobalFoundries and Monolithic Power Systems have signed a long-term manufacturing agreement that will bring MPS power-management technologies to GF’s 300 mm fab in Singapore for volume production starting in early 2027.
September 10, 2026 Companies & Market
d-Matrix will use NVIDIA NVLink Fusion to connect its next-generation Raptor XPUs to NVIDIA infrastructure. The approach ties the chips into NVLink scale-up, Spectrum-X networking and the MGX rack architecture for lower-risk deployment at larger scale.
September 14, 2026 Design & EDA
OpenAI has presented Jalapeño, its first in-house AI accelerator, and says internal LLMs helped compress the design cycle dramatically. The chip combines a compute die with six stacks of HBM4 and an I/O chiplet.
September 14, 2026 Devices & Products
EDN’s teardown of X-Sense’s XR0A-iR reveals how the connected radon alarm measures continuous alpha spectrometry: a PIN photodiode, likely biased by a charge-pump stage, detects and discriminates alpha energies, while an Arm Cortex-M4 MCU and a 2.4 GHz Wi-Fi/Bluetooth LE module handle processing and connectivity.