News – Companies & Market

November 5, 2026 Companies & Market

Infineon HiRel integrates gate-drive regulation into rad-hard GaN driver for space power systems

Infineon HiRel has introduced the RIC70115, a radiation-hardened single-channel gate driver for GaN that integrates a low-dropout regulator to generate a tightly regulated 4.8 V gate-drive rail from 4.75 V to 15 V. The approach is aimed at simplifying space power architectures, reducing component count, and improving drive consistency for high-frequency GaN operation.

Ceva and Mobilint Put NeuPro-Nano into Production in REGULUS Edge AI SoC

Mobilint has brought Ceva’s SensPro AI DSP and NeuPro-Nano NPU into production silicon with the REGULUS edge AI SoC, marking the first deployment of Ceva’s NeuPro NPU family. The chip delivers 10 TOPS at under 3 watts, supports up to 8 GB of memory and is already powering Mobilint’s MLD-R1 AI USB accelerator, which is now shipping.

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November 4, 2026 Companies & Market

Infineon and SOLUM expand work on HVDC power architectures for AI data centers

Infineon Technologies and SOLUM have signed a memorandum of understanding to deepen their collaboration on high-voltage direct current power solutions for AI data centers. The work will focus on intermediate bus converters, battery backup units and power supply units as demand for higher efficiency, higher power density and greater reliability continues to rise in AI infrastructure.

Infineon and Qualcomm pair safety microcontroller subsystem with Snapdragon Ride car-computer platforms

Infineon Technologies is working with Qualcomm Technologies to speed up central car computers for software-defined vehicles. A microcontroller-based subsystem around Infineon AURIX and OPTIREG components is designed to support Snapdragon Ride reference platforms for automated driving and digital cockpit functions, while also simplifying integration into Ethernet- and CAN-based vehicle networks.

STMicroelectronics adds DSP and edge-AI acceleration to STM32H7P MCUs

STMicroelectronics has expanded its STM32H7 family with the STM32H7P microcontrollers, combining a 520 MHz Arm Cortex-M7 core with dedicated DSP and neural-processing hardware for industrial control, digital power, sensing, and edge-AI workloads. The series targets applications that need more real-time performance, higher memory density, and faster inference without moving to a higher-cost platform.

Infineon launches OptiMOS 7 40 V MOSFETs for high-frequency power conversion in AI servers and telecom systems

Infineon has introduced its OptiMOS 7 40 V switching-optimized power MOSFET portfolio for AI servers, data centers and telecom infrastructure. The devices target high-frequency DC-DC conversion, including secondary-side stages in emerging 800 V DC architectures and 48 V power systems, while aiming to cut both conduction and switching losses.

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November 4, 2026 Companies & Market

Infineon debuts AURIX RC1, its first RISC-V microcontroller platform for software-defined vehicles and Physical AI

Infineon has introduced AURIX RC1, a new automotive MCU platform built on the open RISC-V instruction set and aimed at software-defined vehicles, other software-defined systems and Physical AI. The family is designed to scale from traditional microcontrollers to hybrid MCU/MPU devices, combining real-time control, safety, cybersecurity and integrated networking in a single platform concept.

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November 2, 2026 Companies & Market

Macronix expands flash lineup as AI pushes memory architecture toward tiered designs

AI workloads are shifting memory demand beyond raw capacity and bandwidth, lifting demand for mature flash products while Macronix broadens its NOR flash, NAND and eMMC portfolio. The company is increasing 2026 capex to NT$37.8 billion, expanding 12-inch wafer capacity, and pushing higher-density, lower-power and higher-reliability nonvolatile memory for AI servers and other applications.

BIWIN lines up enterprise, industrial, automotive and compact storage for electronica 2026

BIWIN will present a broad storage portfolio at electronica 2026, ranging from 122.88 TB PCIe 5.0 enterprise SSDs to integrated embedded memory, industrial drives for continuous recording, automotive UFS and eMMC devices, and a compact removable Mini SSD. The lineup is aimed at AI infrastructure, edge computing, intelligent vehicles, embedded systems and space-constrained PCs.

Infinitesima pushes angstrom-scale 3D metrology toward production use

Infinitesima is commercializing angstrom-scale process control for semiconductor manufacturing with a hybrid optical/AFM platform that measures chip structures directly in three dimensions. The company says its Metron3D system is already being deployed in production and is aimed at tighter process control for advanced packaging, hybrid bonding, High-NA EUV resist work and post-etch metrology.

Noak raises €5 million to industrialize perovskite-silicon tandem solar cells

Imec spin-off Noak has secured €5 million from the Helios Foundation, Nuhma and V2HFin to scale perovskite-silicon tandem PV and move the technology toward European manufacturing. The company is building on imec and UHasselt IP, long-term outdoor testing data and a cell architecture aimed at higher efficiency, lower metal use and easier recycling.

Samsung posts record quarterly profit on AI memory demand

Samsung Electronics reported third-quarter revenue of 195.3 trillion won and operating profit of 107.4 trillion won, driven by strong demand for AI memory chips. The semiconductor division delivered most of the earnings, while the mobile business remained under pressure from higher component costs and weak margins.

Infineon links edge AI, SDVs and data-center power to the 800 VDC transition

At its OktoberTech event, Infineon tied together three shifts in semiconductor demand: more AI processing at the edge, a slower but ongoing move toward software-defined vehicles, and the push from 800 VDC sidecars toward future 1 MW rack power architectures. The company also pointed to its Dresden fab as new manufacturing capacity for power and analog/mixed-signal devices.

Vinci raises $250 million to speed physics analysis in hardware design

Vinci says it has closed a $250 million Series B at a $1.5 billion valuation and is expanding its physics analysis platform for semiconductor engineering. The company wants to make thermal, thermo-mechanical and convective fluid analysis available while designs are still changing, so engineers can assess placement, power and packaging choices before decisions become costly to reverse.

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October 28, 2026 Companies & Market

SK Hynix posts record Q3 as AI memory demand lifts prices and margins

SK Hynix delivered its first quarter above 100 trillion won in revenue, with operating profit rising to a record 83.33 trillion won and operating margin reaching 80%. The results were driven by sharply higher DRAM prices, easing HBM4 supply concerns, and long-term capacity agreements that point to a tighter memory market through 2030.