Short updates from the semiconductor industry, with context and links to the relevant chapters. RSS
Sort: Newest first · Oldest first
October 29, 2026 Companies & Market
Samsung Electronics reported third-quarter revenue of 195.3 trillion won and operating profit of 107.4 trillion won, driven by strong demand for AI memory chips. The semiconductor division delivered most of the earnings, while the mobile business remained under pressure from higher component costs and weak margins.
October 29, 2026 Devices & Products
Programmable mixed-signal ICs can replace bulky RC timing networks and firmware-dependent startup logic with deterministic multi-rail sequencing. GreenPAK devices combine counters, lookup tables, comparators, state machines, and GPIO routing to control regulator enables, qualify power-good signals, verify rail thresholds, latch faults, and manage orderly shutdown without relying on processor firmware.
October 30, 2026 Industry & People
HBM and DRAM supply remains tight across the industry, while advanced packaging capacity is being pushed harder by AI demand. At the same time, foundries, equipment makers and AI infrastructure suppliers are expanding investments, pricing, and partnerships to keep pace with next-generation compute and memory ramps.
October 30, 2026 Manufacturing & Processes
AI is reshaping semiconductor factories as much as the systems they produce. Intel Foundry says scaling AI now depends not only on smaller transistors, but also on power delivery, connectivity, advanced packaging and supply chain resilience, while AI is also being used to improve quality and shorten yield learning in manufacturing.
October 30, 2026 Research
AI is already becoming effective in semiconductor design, where models, rules, constraints, and solver outputs define a structured environment. Manufacturing is harder because it has to manage the physical reality of as-built geometry, process drift, material variation, and measurement evidence across the package and process flow.
October 30, 2026 Companies & Market
Imec spin-off Noak has secured €5 million from the Helios Foundation, Nuhma and V2HFin to scale perovskite-silicon tandem PV and move the technology toward European manufacturing. The company is building on imec and UHasselt IP, long-term outdoor testing data and a cell architecture aimed at higher efficiency, lower metal use and easier recycling.
November 1, 2026 Research
Intel is already using High-NA EUV on selected layers in a subset of Panther Lake processors, Samsung has outlined a DRAM rollout for 2028, and TSMC plans advanced-node volume adoption from 2030. The technology still faces smaller exposure fields, stitching constraints and tough economics, but recent production milestones suggest its deployment curve is only delayed, not derailed.
November 1, 2026 Companies & Market
Infinitesima is commercializing angstrom-scale process control for semiconductor manufacturing with a hybrid optical/AFM platform that measures chip structures directly in three dimensions. The company says its Metron3D system is already being deployed in production and is aimed at tighter process control for advanced packaging, hybrid bonding, High-NA EUV resist work and post-etch metrology.
November 1, 2026 Artificial intelligence
Flexcompute says it is extending its Physics World Model into AI-assisted chip design, with PhotonForge 2.0, physics-verified compact models and automatic Verilog-A export. The company is targeting photonic chips, optical I/O, co-packaged optics and advanced packaging problems such as warpage, thermal effects and signal integrity.
November 2, 2026 Companies & Market
BIWIN will present a broad storage portfolio at electronica 2026, ranging from 122.88 TB PCIe 5.0 enterprise SSDs to integrated embedded memory, industrial drives for continuous recording, automotive UFS and eMMC devices, and a compact removable Mini SSD. The lineup is aimed at AI infrastructure, edge computing, intelligent vehicles, embedded systems and space-constrained PCs.
November 2, 2026 Companies & Market
AI workloads are shifting memory demand beyond raw capacity and bandwidth, lifting demand for mature flash products while Macronix broadens its NOR flash, NAND and eMMC portfolio. The company is increasing 2026 capex to NT$37.8 billion, expanding 12-inch wafer capacity, and pushing higher-density, lower-power and higher-reliability nonvolatile memory for AI servers and other applications.