Short updates from the semiconductor industry, with context and links to the relevant chapters. RSS
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September 18, 2026 Circuit Design & Applications
Cosmic radiation and alpha particles can still flip bits in FPGA configuration memory outside space systems. The article outlines how modern designs combine CRAM readback, scrubbing, ECC, and triple modular redundancy to detect and recover from these upsets.
September 18, 2026 Industry & People
A community post on EDN gathers small but useful habits from day-to-day engineering work, from thorough documentation to involving repair teams and machinists early in a design.
September 17, 2026 Companies & Market
GlobalFoundries and Marvell have widened their multi-year collaboration to increase capacity for GF’s silicon germanium technology, targeting next-generation optical links for AI data centers and network infrastructure.
September 17, 2026 Devices & Products
STMicroelectronics’ SafeSense VD56GA targets driver and occupant monitoring with a 1.1-megapixel infrared sensor based on DeepNIR BSI pixels. The company says the part improves sharpness and sensitivity while reducing camera-module complexity and space requirements.
September 17, 2026 Devices & Products
Singular Photonics has introduced Litavis, a CMOS single-photon avalanche diode image sensor that performs digital photon processing directly on-chip and within the pixel. The company says the architecture is aimed at reducing data traffic, latency, and power while supporting low-light imaging and time-resolved capture.
September 17, 2026 Devices & Products
SFP and its higher-speed variants have become a compact, hot-swappable interface for networking gear that can bridge copper, direct-attach cabling, and optical fiber. The module family spans legacy GBIC and XFP concepts as well as SFP, SFP+, QSFP, and cSFP options, each trading density, speed, and reach in different ways.
September 17, 2026 Manufacturing & Processes
onsemi has introduced an Embedded Power Platform that uses the silicon wafer itself as the package foundation, embedding multiple dies and combining electrical, thermal, and mechanical co-design to raise power density in AI and automotive power systems.
September 16, 2026 Devices & Products
Infineon has introduced the PSOC Control C3 Performance Line MCU family for real-time power and motor control. The new devices combine high switching-frequency control, analog support, and PQC-ready firmware protection in a Cortex-M33-based architecture.
September 16, 2026 Devices & Products
Infineon has introduced the OPTIREG TLE9744QK, a fully integrated PMIC for high-voltage traction inverter ECUs in HEVs and EVs. The device combines power-supply functions, resolver excitation, and an independent safety engine in one chip, while reducing component count and PCB area.
September 16, 2026 Devices & Products
Infineon has introduced the EiceDRIVER 2EDL6014AC-G2D, a compact dual-channel floating gate driver aimed at high-density power conversion in AI datacenter hardware. The 120 V device combines independent high-side control, strong source and sink drive, and thermal features for continuous server workloads.
September 16, 2026 Companies & Market
Infineon Technologies has agreed to divest its NOR Flash and F-RAM business to Winbond Electronics in an all-cash transaction valued at $1.12 billion. The company says the move will let it concentrate more strongly on power semiconductors and other core growth areas.
September 16, 2026 Companies & Market
Infineon is delivering 1200 V CoolSiC MOSFETs to Fox ESS for residential energy storage systems. The partnership targets lower switching losses, higher efficiency and improved thermal performance in hybrid inverter and battery designs.
September 16, 2026 Companies & Market
Infineon Technologies AG says radiation-hardened HiRel power devices are part of the power system on NASA’s Nancy Grace Roman Space Telescope, which has now launched toward the L2 orbit. The mission places qualification depth, radiation tolerance and long-term availability at the center of the component choice.
September 16, 2026 Companies & Market
Infineon Technologies Asia Pacific and Tack One have been recognized by the Singapore International Chamber of Commerce for co-developing FloodFinder™, a self-sustaining flood monitoring system that combines semiconductor sensing with ultra-low-power IoT system design.
September 16, 2026 Devices & Products
Infineon has introduced the TDA235E5 and TDA235E0, a dual-phase smart power stage family for next-generation AI accelerators and vertical power delivery modules. The devices combine OptiMOS 6 MOSFETs with a dual-phase driver IC in a compact package and are rated for more than 2 A/mm² power density.