News – Page 3 - Halbleiter.org

October 28, 2026 Companies & Market

Intel Foundry Links Metrology, AI, and Packaging Data for More Connected Manufacturing

Intel Foundry is framing manufacturing autonomy as a measurement problem first: without trustworthy metrology, connected data, and human oversight, AI cannot safely improve fab decisions. The company’s SEMICON West 2026 presentations point to work across defect classification, thermal modeling, advanced chiplet test, and open automation standards, with the goal of linking fabrication, assembly, and test into a single decision chain.

Infineon introduces 5.6 kW M-CRPS reference design for dense enterprise AI servers

Infineon has launched a 5.6 kW modular common redundant power supply reference design for enterprise servers and edge AI systems. The compact 185 mm M-CRPS platform combines a peak efficiency above 98%, 170 W/in³ power density, and a 54 VDC output with fast transient response for AI workloads.

Infineon and Enphase extend GaN bidirectional switches to 900 V for SST power modules

Infineon will supply Enphase Energy with the first 900 V gallium nitride monolithic bidirectional switches for solid-state transformer power modules. The devices are aimed at AI data centers and are intended to combine higher voltage headroom with the high-frequency switching needed for compact, efficient power conversion.

Infineon launches ENDOPACK chip-embedding platform for high-voltage traction inverters

Infineon has introduced ENDOPACK, a new chip-embedding platform that extends PCB-based integration from low-voltage production into high-voltage power electronics. The first product, ENDOPACK Cell, is an automotive-qualified 1200 V solution with CoolSiC MOSFETs built directly into the board, targeting faster traction-inverter development, higher design flexibility, and lower inductance than conventional module approaches.

Read more → · Advanced Packaging

October 27, 2026 Companies & Market

Infineon launches LinearFET for automotive solid-state power distribution

Infineon has introduced LinearFET, a MOSFET technology aimed at simplifying next-generation solid-state power distribution in electric and software-defined vehicles. The device-level approach integrates current sharing, inrush current control, and short-circuit robustness to reduce external circuitry, board space, and implementation complexity.

S2C pushes faster RISC-V bring-up with FPGA prototyping and AI-assisted debug

At the sixth RISC-V Summit China, S2C highlighted a three-part workflow for earlier processor validation: FPGA prototyping for substantial RISC-V systems, automated first-pass RTL compilation analysis, and LLM-assisted interpretation of virtual-platform debug data. The demonstrations centered on an Andes Technology AX66-based RISC-V configuration running Linux KVM on S2C’s Prodigy S8-100 system, plus tooling around XiangShan RTL and a virtual platform for reproducible debug.

Infineon adds ultra-low-resistance OptiMOS 7 automotive MOSFETs in TOLL package

Infineon has expanded its OptiMOS 7 automotive MOSFET line with new 40 V, 80 V and 100 V devices in the established 10 × 12 mm² TOLL package. The parts combine a clip-based interconnection concept with the existing footprint to cut on-resistance, switching losses and thermal dissipation in 12 V and 48 V automotive power stages.

imec maps the next scaling steps for optical interconnects in AI systems

Exploding bandwidth demand from cloud and AI workloads is pushing optical links closer to silicon, from pluggable transceivers to co-packaged optics and eventually 3D integrated optical fabrics. imec highlights a roadmap built around higher per-lane rates, denser packaging, and heterogeneous electro-optic materials such as lithium niobate, lithium tantalate, and barium titanate.

October 26, 2026 Manufacturing & Processes

Test Costs for Co-Packaged Optics Move Closer to Manufacturing Cost

As co-packaged optics moves toward high-volume manufacturing, test strategies are shifting toward earlier screening, known-good optical engines, and tighter failure isolation. The discussion centers on how to keep expensive GPUs and ASICs from being taken down by a faulty photonics device while controlling the rising cost and complexity of optical test.

Read more → · Advanced Packaging

October 26, 2026 Research

Large-format masks move from aspiration to an industry roadmap

A new industry push is aligning photomask makers, equipment suppliers, and chipmakers around a 12-inch mask format by 2031, driven by a productivity case tied to High-NA EUV. The panel discussion also pointed to growing demand for new mask-etch capability, curvilinear masks, and better supply-chain coordination.

STMicroelectronics launches first automotive safety combination sensors for mass-market use

STMicroelectronics has introduced a new family of automotive combination sensors that merge a multi-axis accelerometer and a gyroscope in one ISO 26262-compliant package. The devices are intended to help OEMs and Tier-1 suppliers scale active and passive safety functions from premium vehicles into mass-market platforms, with production already underway.

Read more → · Advanced Packaging

October 26, 2026 Research

Accellera releases FSL 1.0 to standardize functional safety data exchange

Accellera Systems Initiative has approved Functional Safety Language Standard 1.0, a data model and syntax for moving functional safety information more reliably between tools, engineering teams, and companies. The standard is aimed at a long-standing problem in semiconductor development: keeping assumptions, failure analyses, and verification results aligned as safety data moves from IP to chips and into system integration.

Applied Materials to raise stake in Besi to about 20%

Applied Materials will increase its strategic investment in BE Semiconductor Industries (Besi) to approximately 20 percent of the company’s outstanding shares. The expanded partnership focuses on hybrid bonding, new interconnect architectures, and packaging platforms for 3D IC scaling, logic-memory integration, and die-on-wafer, die-on-die, and die-on-panel assembly.

Read more → · Advanced Packaging

October 26, 2026 Manufacturing & Processes

Testing Silicon Photonics at High Volume Requires More than Device Innovation

As silicon photonics moves toward production-scale deployment in data centers, test flows are becoming a central manufacturing problem. Automated optical alignment, polarization control, combined electrical and optical measurements, and integrated instrumentation are all needed to keep throughput and repeatability at HVM levels.

Infineon to build first high-volume 300 mm GaN power semiconductor fab in Europe

Infineon will invest about €1.1 billion in Villach to create the world’s first high-volume manufacturing facility for gallium nitride power semiconductors on 300-millimeter wafers in Europe. The ramp-up is scheduled to begin by the end of 2027, with funding support of €319 million under the European Chips Act.